Infrared BGA Soldering Station Reballing Kits Preheat Area 240*200mm 6 pcs Jig LY IR6500 V.2 for Motherboard Chips Rework Repair |

Infrared BGA Soldering Station Reballing Kits Preheat Area 240*200mm 6 pcs Jig LY IR6500 V.2 for Motherboard Chips Rework Repair |

IR6500 V.2 Rework station for laptop motherboards, desktop computer motherboards, server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework.

IR6500 V.2 innovative designs an effective solution to general of infrared rework station vulnerable to the impact of air flow. will lead an inaccurate of temperature control can easily deal with lead-free soldering rework.

Basic Parameters

Heating

IR

Dimension

L495mmx W480mmx H420mm

Weight

16kg

Total weight

About 17 kg, vary with the  differen need of the users

Electrical Parameters

Power

220V AC

Upper Heating

IR

Size of Upper heating

80mm x 80mm

Consumption of upper heating

450W

Bottom Heating

IR

Size of Bottom heating

2400mm x2000mm

Consumption of Bottom heating

1800W

General power

2300W

Temperature Control

Control mode of Upper

Independent temperature control, high-precision closed-loop
control, precision ± 0.5%, Alarm

Control mode of Bottom

Independent temperature control, high-precision closed-loop
control, precision ± 0.5%, NO Alarm

Rework Function

SMD

Suit for welding, remove or repair packaged devices
such as BGA,PBGA,CSP,multi-layer substrates, EMI
metallic shield product and solder/lead free Rework welding

Size of applicable chips

≤70mm x70 mm

Size of applicable PCB

≤400mm x305mm

1× bga rework station

1× power cable

1× usb to rs232 port cable (with CD)

1× thermocouple

1× vacuo pen

1x tweezers

6x pcb jig with screw

1× CD of manual and software (if not get, may be lost in customs, please contact us)